Quality Assurance Liaison Global Technical Ink Mfg: 01/2022 to 032022Work on a global manufacturing team to ensure that ink supplies meetquality metrics to achieve GMP, PPAP, ISO9001,and QSR metrics and are audit ready.Also work with team to ensure that global teams are working togetherfor line transfer of inks, commodities and processes all while maintaining their quality systems and processes based on regulatory requirements. Make fitness for use documentation for Inks that were at risk for not having risk mitigation plans in place and identify anyeQOC gaps in the system.Self Employed Property Developer/Investor, Corvallis, OR (2014 - present): Develop, Market and sell properties. Manage personal real estate and stock investments.

New Product Introduction--SC Procurement/Quality Engineer; HP Inc - Corvallis, OR; (July, 1997- November, 2009 ). Worked on various Inkjet platforms to develop adhesives for MEMs application on the thermal printhead: ● HP technical liaison. Worked to ensure Mfg. readiness throughout product value chain(development to launch).● Managed quality systems both internally and external supplier quality systems. ● Sourced new materials and created product specifications to meet manufacturing requirements for multi-billion/global operations.● Set up and used ERP tools to enable real time troubleshooting, inventory control and monitor non-conformance issues. ● Worked with procurement team, buyers and procurement manager to address materials logistics and supply issues and ensure product fulfilment on a global basis. ● Worked with with cross functional teams to ensure smooth handoff of technologies to sister-sites.● Assign critical metrics for materials characterization, process control and manufacturing stability. ● Assess quality metrics via: DSC, Rheology, GPC, TGA, FTIR, SIMS, SEM, HPLC, DMA, ink soak ● Worked with manufacturing to resolve line-down situations from contamination sources. ● Involved in Methods development for analysis of new materials that required environmental and shelf-life metrics.● Performed Quality Audits, managed supplier contract agreements: CDA s, NDA s etc. Wafer Fab Photo/Wet Etch Process Engineer; HP Inc. - Corvallis, OR; (July, 1995 - September, 1997): ● Technical lead for capital equipment buy-off; characterize process and establish for manufacturing. ● Set up overall process and yield improvement plans and brought up yield from ~(70 to 90+)%● Establish metrology characteristics of photo-resist and photo wet etch metrics. ● Logistics transfer lead for Photo/Etch process move from Corvallis, OR to Boise, ID.

SOLA Optical USA; Petaluma, CA; (March, 1993 - May, 1995): Worked on the cure process for a UV curable adhesive for Transitions lens program designed to create a person’s Rx for eyeglasses in about 20min. The lenses also had photo-chromic imbibed dye that would turn in to sunglasses in daylight and lighten at dusk.● R&D project engineer for new optical applications and manufacturing coating processes.● Worked on a team to developed peel coating for novel transitions lens program.● Created novel coating formulations and scaled up mfg. coating(s) processes and packaging design(s).

Developed novel curing agents and catalysts for epoxy adhesive formulations.● Performed organic synthesis reactions for adhesives development, monitored reaction kinetics, chemical and physical properties via: GC, HPLC, UV, GPC, DSC, DMA, & TGA. Developed novel epoxy curing agents/cure modifiers.