Yu Cheng Chu

Yu Cheng Chu Email and Phone Number

Process Integration Engineer at Winbond @ 華邦電子
taichung city, taiwan, taiwan
Yu Cheng Chu's Location
Tainan City, Tainan City, Taiwan, Taiwan, Province of China
About Yu Cheng Chu

Im working as a process engineer in the diffusion department at TSMC. I am in charge of mainly working with Hsinchu F12B partner to develop new N3 processes and process improvement projects for existing products (EX: N7/N5 tec). My first priority with TSMC was introduce mass production for the newly developed process with N3 tec to Tainan F18B ; It is necessary to have a deep understanding of each process in the factory, effectively integrate the in-plant process technology and communicate with integration and equipment engineer to achieve the best development conditions, and effectively and smoothly mass production in the factory. Improvement of the existing process: Carry out capacity utilization for the existing technology in the factory, try different DOEs to confirm their failure modes to improve the process, and introduce a new process.After process engineer experience learning, I become Integration Engineer to learn more about Integrate Circuit at Winbond Company. For product Integration Engineer and in charge of analysis, electrical measurement, data analyzing, proposing experimental verification, imporving product quality and process stability , assisting in the introduction of new processes into mass production, as well as evaluating and carrying out projects to reduce the process costs.

Yu Cheng Chu's Current Company Details
華邦電子

華邦電子

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Process Integration Engineer at Winbond
taichung city, taiwan, taiwan
Website:
winbond.com
Employees:
927
Yu Cheng Chu Work Experience Details
  • 華邦電子
    製程整合工程師
    華邦電子 Oct 2022 - Present
    台灣 高雄市 路竹區
    ● Product online issue handling and failure analysis.● Improve product yield and keep process stability.● Introduce new processes into mass production.● Cost down/Process improvement project.● New product pirun and issue handling for Market demand.
  • Tsmc
    Process Engineer
    Tsmc Jan 2021 - Aug 2022
    ● N3 Second tool release and maintenance for increased capacity utilization.● Advanced N3 layer information in the co-work meeting with F12B partner.

Yu Cheng Chu Education Details

Frequently Asked Questions about Yu Cheng Chu

What company does Yu Cheng Chu work for?

Yu Cheng Chu works for 華邦電子

What is Yu Cheng Chu's role at the current company?

Yu Cheng Chu's current role is Process Integration Engineer at Winbond.

What schools did Yu Cheng Chu attend?

Yu Cheng Chu attended National Chiao Tung University.

Who are Yu Cheng Chu's colleagues?

Yu Cheng Chu's colleagues are P.j. Chang, Chung Wen Sun, Yian Chen, Ya-Wen Ho, Hong Tse Lin, Chao-Chuan Chang, 陳建君.

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