Yu Cheng Chu
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Yu Cheng Chu Email & Phone Number

Process Integration Engineer at Winbond at 華邦電子
Location: Tainan City, Taiwan, Province of China 2 work roles 1 school
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Current company
Role
Process Integration Engineer at Winbond
Location
Tainan City, Taiwan, Province of China
Company size

Who is Yu Cheng Chu? Overview

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Quick answer

Yu Cheng Chu is listed as Process Integration Engineer at Winbond at 華邦電子, a with 927 employees, based in Tainan City, Taiwan, Province of China. AeroLeads shows a matched LinkedIn profile for Yu Cheng Chu.

Yu Cheng Chu previously worked as 製程整合工程師 at 華邦電子 and Process Engineer at Tsmc. Yu Cheng Chu holds Materials Engineering from National Chiao Tung University.

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華邦電子

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Profile bio

About Yu Cheng Chu

Im working as a process engineer in the diffusion department at TSMC. I am in charge of mainly working with Hsinchu F12B partner to develop new N3 processes and process improvement projects for existing products (EX: N7/N5 tec). My first priority with TSMC was introduce mass production for the newly developed process with N3 tec to Tainan F18B ; It is necessary to have a deep understanding of each process in the factory, effectively integrate the in-plant process technology and communicate with integration and equipment engineer to achieve the best development conditions, and effectively and smoothly mass production in the factory. Improvement of the existing process: Carry out capacity utilization for the existing technology in the factory, try different DOEs to confirm their failure modes to improve the process, and introduce a new process.After process engineer experience learning, I become Integration Engineer to learn more about Integrate Circuit at Winbond Company. For product Integration Engineer and in charge of analysis, electrical measurement, data analyzing, proposing experimental verification, imporving product quality and process stability , assisting in the introduction of new processes into mass production, as well as evaluating and carrying out projects to reduce the process costs.

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華邦電子
華邦電子
Process Integration Engineer at Winbond
taichung city, taiwan, taiwan
Website
Employees
927
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2 roles

Yu Cheng Chu work experience

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製程整合工程師

Current

台灣 高雄市 路竹區

● Product online issue handling and failure analysis.● Improve product yield and keep process stability.● Introduce new processes into mass production.● Cost down/Process improvement project.● New product pirun and issue handling for Market demand.

Oct 2022 - Present

Process Engineer

● N3 Second tool release and maintenance for increased capacity utilization.● Advanced N3 layer information in the co-work meeting with F12B partner.

Jan 2021 - Aug 2022
Team & coworkers

Colleagues at 華邦電子

Other employees you can reach at winbond.com. View company contacts for 927 employees →

1 education record

Yu Cheng Chu education

FAQ

Frequently asked questions about Yu Cheng Chu

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What company does Yu Cheng Chu work for?

Yu Cheng Chu works for 華邦電子.

What is Yu Cheng Chu's role at 華邦電子?

Yu Cheng Chu is listed as Process Integration Engineer at Winbond at 華邦電子.

Where is Yu Cheng Chu based?

Yu Cheng Chu is based in Tainan City, Taiwan, Province of China while working with 華邦電子.

What companies has Yu Cheng Chu worked for?

Yu Cheng Chu has worked for 華邦電子 and Tsmc.

Who are Yu Cheng Chu's colleagues at 華邦電子?

Yu Cheng Chu's colleagues at 華邦電子 include Peter Yung, Will Yu, 蔡世泓, Lauren P., and Jamie Chen.

How can I contact Yu Cheng Chu?

You can use AeroLeads to view verified contact signals for Yu Cheng Chu at 華邦電子, including work email, phone, and LinkedIn data when available.

What schools did Yu Cheng Chu attend?

Yu Cheng Chu holds Materials Engineering from National Chiao Tung University.

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