APECS Pilot Line

APECS (Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems) is the novel pan-European pilot line for advanced packaging and heterogeneous integration, established under the EU Chips Act. By pushing the boundaries of semiconductor innovation, APECS strengthens Europe’s technological resilience and global competitiveness. The purpose of the APECS pilot line is to bridge cutting-edge research with scalable manufacturing solutions, focusing on emerging chiplet innovations and heterogeneous integration. Moving beyond current system-in-package (SiP) approaches, APECS delivers robust and trusted heterogeneous systems to boost the innovation capacity of the European semiconductor industry. APECS provides large industry players, SMEs, and start-ups with access to state-of-the-art technology through a single point of contact. APECS provides end-to-end design and pilot production capabilities, accelerating progress from innovation to market-ready solutions. All developments within the APECS scope are carried out under the guidelines of the European Green Deal. The APECS consortium brings together the technological competences, infrastructure, and know-how of ten partners from eight European countries: Germany: Fraunhofer-Gesellschaft (Coordinator), FBH, IHP; France: CEA-Leti; Belgium: imec; Finland: VTT; Austria: TU Graz; Greece: FORTH; Spain: IMB-CNM, CSIC; Portugal: INL. Together, the APECS partners are creating a vibrant innovation ecosystem, empowering Europe to lead the semiconductor future. Coordinated by the Fraunhofer-Gesellschaft and implemented by the Research Fab Microelectronics Germany (FMD), APECS fosters collaboration among industry, academia, and research organizations. APECS is co-funded by the Chips Joint Undertaking and national funding authorities of Austria, Belgium, Finland, France, Germany, Greece, Portugal, Spain, through the Chips for Europe Initiative.