FAMES Pilot Line
Company

FAMES Pilot Line

Research Services The Technological Challenges of Tomorrow for Hybrid Bonding and Advanced Packaging? 6 employees
Employees
6

FAMES Pilot Line Overview

Headquarters
The Technological Challenges of Tomorrow for Hybrid Bonding and Advanced Packaging?
Industry
Research Services
Employees
6
NAICS
Scientific Research and Development Services
Research and Development in the Physical, Engineering, and Life Sciences
Research and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)

About FAMES Pilot Line

FAMES Pilot Line is a pioneering initiative driving semiconductor technologies in Europe by supporting the emergence of higher-performance, more energy-efficient, and more sustainable chip designs. Its objectives align with those of the EU Chips Act, namely, to bolster the EU semiconductor industry and support European technological sovereignty through cutting-edge innovations, facilitated access to R&D and training. The FAMES Consortium brings together an outstanding group of partners: the pilot line coordinator, CEA-Leti (France), imec (Belgium), Fraunhofer Mikroelektronik (Germany), Tyndall (Ireland), VTT (Finland), CEZAMAT WUT (Poland), UCLouvain (Belgium), Silicon Austria Labs (Austria), SiNANO Institute (France), Grenoble INP-UGA (France) and the University of Granada (Spain).

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