FAMES Pilot Line
Research Services
The Technological Challenges of Tomorrow for Hybrid Bonding and Advanced Packaging?
6 employees
- Employees
- 6
FAMES Pilot Line Overview
- Headquarters
- The Technological Challenges of Tomorrow for Hybrid Bonding and Advanced Packaging?
- Website
- fames-pilot-line.eu
- Industry
- Research Services
- Employees
- 6
- NAICS
-
Scientific Research and Development ServicesResearch and Development in the Physical, Engineering, and Life SciencesResearch and Development in the Physical, Engineering, and Life Sciences (except Nanotechnology and Biotechnology)
About FAMES Pilot Line
FAMES Pilot Line is a pioneering initiative driving semiconductor technologies in Europe by supporting the emergence of higher-performance, more energy-efficient, and more sustainable chip designs. Its objectives align with those of the EU Chips Act, namely, to bolster the EU semiconductor industry and support European technological sovereignty through cutting-edge innovations, facilitated access to R&D and training. The FAMES Consortium brings together an outstanding group of partners: the pilot line coordinator, CEA-Leti (France), imec (Belgium), Fraunhofer Mikroelektronik (Germany), Tyndall (Ireland), VTT (Finland), CEZAMAT WUT (Poland), UCLouvain (Belgium), Silicon Austria Labs (Austria), SiNANO Institute (France), Grenoble INP-UGA (France) and the University of Granada (Spain).
Compare Similar Companies to FAMES Pilot Line
Consiglio Nazionale delle Ricerche
Research Services
Imec
Research Services
Fraunhofer-Gesellschaft
Research Services
CEA-Leti
Semiconductor Manufacturing
ICFO
Research
Chips Joint Undertaking
Research Services
FMD - Forschungsfabrik Mikroelektronik Deutschland
Research Services
SiNANO Institute
Research Services
APECS Pilot Line
Research Services
NanoIC pilot line
Semiconductor Manufacturing