Jedec

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JEDEC is the global leader in the development of standards for the microelectronics industry. Thousands of volunteers representing over 350 member companies work together in more than 100 JEDEC committees and task groups to meet the needs of every segment of the industry, for manufacturers and consumers alike. JEDEC invites participation on a worldwide basis, and the involvement of key technical experts from most device, assembly, system and testing companies enables JEDEC to publish technical standards with high value. The publications and standards generated by JEDEC committees are accepted throughout the world, and help promote global trade by enabling healthy, high-volume markets to flourish. All JEDEC standards are available for download via JEDEC's website at www.jedec.org.

Company Details

Employees
29
Founded
-
Address
3103 10th St N, Arlington,virginia 22201,united States
Phone
7039077515
Industry
Industry Associations
NAICS
Business Associations
Website
jedec.org
HQ
Arlington, Virginia
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News

JEDEC Announces Annual Update of DDR5 Serial Presence Detect (SPD) Contents Standard - FinancialContent

JEDEC Announces Annual Update of DDR5 Serial Presence Detect (SPD) Contents Standard FinancialContent

JEDEC Releases New LPDDR6 Standard to Enhance Mobile and AI Memory Performance - Business Wire

JEDEC Releases New LPDDR6 Standard to Enhance Mobile and AI Memory Performance Business Wire

Contact - The Lethbridge Herald - News and Sports from around Lethbridge - FinancialContent

Contact - The Lethbridge Herald - News and Sports from around Lethbridge FinancialContent

JEDEC® Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standards - Business Wire

JEDEC® Announces Updates to Universal Flash Storage (UFS) and Memory Interface Standards Business Wire

A JEDEC standard for CXL memory modules ... - eeNews Europe

A JEDEC standard for CXL memory modules ... eeNews Europe

JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel HPC and AI - HPCwire

JEDEC Unveils Plans for DDR5 MRDIMM and LPDDR6 CAMM Standards to Propel HPC and AI HPCwire

JEDEC releases HBM4 standard: ready for next-gen AI and HPC memory of the future - TweakTown

JEDEC releases HBM4 standard: ready for next-gen AI and HPC memory of the future TweakTown

UFS 5.0 Is Coming: JEDEC® Sets the Stage for the Next Leap in Flash Storage - FinancialContent

UFS 5.0 Is Coming: JEDEC® Sets the Stage for the Next Leap in Flash Storage FinancialContent

JEDEC Announces Enhanced NAND Flash Interface Standard With Increased Speeds and Efficiency - Business Wire

JEDEC Announces Enhanced NAND Flash Interface Standard With Increased Speeds and Efficiency Business Wire

JEDEC releases LPDDR6 targeting mobile and AI ... - eeNews Europe

JEDEC releases LPDDR6 targeting mobile and AI ... eeNews Europe

JEDEC Publishes Essential Test Method to Address Switching Energy Loss in Wide Bandgap and Silicon Semiconductor Power Devices - Business Wire

JEDEC Publishes Essential Test Method to Address Switching Energy Loss in Wide Bandgap and Silicon Semiconductor Power Devices Business Wire

Adds to Suite of Standards Supporting Compute Express Link - Business Wire

Adds to Suite of Standards Supporting Compute Express Link Business Wire

JEDEC Board Presents 2023 Distinguished Executive Leadership Award to AMD CEO Dr. Lisa T. Su - Business Wire

JEDEC Board Presents 2023 Distinguished Executive Leadership Award to AMD CEO Dr. Lisa T. Su Business Wire

JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration - Business Wire

JEDEC Announces New Release of JEP30 Part Model Guidelines, Empowering Chiplet Integration Business Wire

JEDEC Publishes Major Update to JEP30 PartModel Guidelines - Business Wire

JEDEC Publishes Major Update to JEP30 PartModel Guidelines Business Wire

CXL™ Consortium and JEDEC® Sign MOU Agreement to Advance DRAM and Persistent Memory Technology - Business Wire

CXL™ Consortium and JEDEC® Sign MOU Agreement to Advance DRAM and Persistent Memory Technology Business Wire

Intel CEO Pat Gelsinger Receives 2024 Distinguished Executive Leadership Award from JEDEC Board - Business Wire

Intel CEO Pat Gelsinger Receives 2024 Distinguished Executive Leadership Award from JEDEC Board Business Wire

JEDEC Recognizes Nantero’s Bill Gervasi with Award of Excellence - Business Wire

JEDEC Recognizes Nantero’s Bill Gervasi with Award of Excellence Business Wire

JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard - HPCwire

JEDEC Publishes HBM3 Update to High Bandwidth Memory (HBM) Standard HPCwire

JEDEC unveils LPDDR6 standard to enhance mobile and AI memory performance - New Electronics

JEDEC unveils LPDDR6 standard to enhance mobile and AI memory performance New Electronics

JEDEC Expands CAMM Standardization to include Two Key Memory Technologies - FinancialContent

JEDEC Expands CAMM Standardization to include Two Key Memory Technologies FinancialContent

JEDEC Publishes Update to DDR5 SDRAM Standard Used in High-Performance Computing Applications - HPCwire

JEDEC Publishes Update to DDR5 SDRAM Standard Used in High-Performance Computing Applications HPCwire

JEDEC announces release of the JESD270-4 HBM4 standard - New Electronics

JEDEC announces release of the JESD270-4 HBM4 standard New Electronics

JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Series of Documents for Reliability and Testing of Silicon Carbide (SiC) MOSFETs - FinancialContent

JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Series of Documents for Reliability and Testing of Silicon Carbide (SiC) MOSFETs FinancialContent

JEDEC unveils new plans for DDR5 MRDIMM and LPDDR6 CAMM standards - New Electronics

JEDEC unveils new plans for DDR5 MRDIMM and LPDDR6 CAMM standards New Electronics

JEDEC’s JC-15 Committee Invites Industry Participation for Advancing Thermal Characterization Standards for Semiconductor Packages | Penticton Herald: Finance - FinancialContent

JEDEC’s JC-15 Committee Invites Industry Participation for Advancing Thermal Characterization Standards for Semiconductor Packages | Penticton Herald: Finance FinancialContent

Lilbits: Third-party app stores coming to Google Play, UFS 5.0 storage spec approved, and the beginning of the end for 4G LTE? - Liliputing

Lilbits: Third-party app stores coming to Google Play, UFS 5.0 storage spec approved, and the beginning of the end for 4G LTE? Liliputing

A Look at the New ANSI/ESDA/JEDEC JS-002 CDM Test Standard - In Compliance Magazine

A Look at the New ANSI/ESDA/JEDEC JS-002 CDM Test Standard In Compliance Magazine

Goodbye, SO-DIMM: CAMM2 is here to replace you with 192GB+ capacities, huge space savings - TweakTown

Goodbye, SO-DIMM: CAMM2 is here to replace you with 192GB+ capacities, huge space savings TweakTown

JEDEC Publishes HBM3 Standard (JESD238) - Phoronix

JEDEC Publishes HBM3 Standard (JESD238) Phoronix

New Joint Standard for Component Level ESD Sensitivity Testing – Charged Device Model - In Compliance Magazine

New Joint Standard for Component Level ESD Sensitivity Testing – Charged Device Model In Compliance Magazine

JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices | Penticton Herald: Finance - FinancialContent

JEDEC Wide Bandgap Power Semiconductor Committee Publishes a Milestone Document for Reverse Bias Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices | Penticton Herald: Finance FinancialContent

Intel CEO Pat Gelsinger Receives 2024 Distinguished Executive Leadership Award from JEDEC Board - FinancialContent

Intel CEO Pat Gelsinger Receives 2024 Distinguished Executive Leadership Award from JEDEC Board FinancialContent

JEDEC makes GDDR5X official, features 2x the bandwidth of GDDR5 - TweakTown

JEDEC makes GDDR5X official, features 2x the bandwidth of GDDR5 TweakTown

JEDEC® Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standard - FinancialContent

JEDEC® Updates Universal Flash Storage (UFS) and Supporting Memory Interface Standard FinancialContent

JEDEC Recognizes Nantero’s Bill Gervasi with Award of Excellence - FinancialContent

JEDEC Recognizes Nantero’s Bill Gervasi with Award of Excellence FinancialContent

SAE International and JEDEC Sign Standards Cooperation Agreement for Microelectronic Use in Aviation, Space and Defense | Penticton Herald: Finance - FinancialContent

SAE International and JEDEC Sign Standards Cooperation Agreement for Microelectronic Use in Aviation, Space and Defense | Penticton Herald: Finance FinancialContent

JEDEC Announces Publication of the SPD5118 Hub and Serial Presence Detect Device and the DDR5 SPD Contents Specifications | Penticton Herald: Finance - FinancialContent

JEDEC Announces Publication of the SPD5118 Hub and Serial Presence Detect Device and the DDR5 SPD Contents Specifications | Penticton Herald: Finance FinancialContent

JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications - FinancialContent

JEDEC Publishes New and Updated Standards for Low Power Memory Devices Used in 5G and AI Applications FinancialContent

Rethinking Electrical Overstress - In Compliance Magazine

Rethinking Electrical Overstress In Compliance Magazine

UFS 3.0 specification now finalized for the next generation of smartphones and automobiles - Notebookcheck

UFS 3.0 specification now finalized for the next generation of smartphones and automobiles Notebookcheck

Rambus: Friend or Foe? - IEEE Spectrum

Rambus: Friend or Foe? IEEE Spectrum

JEDEC announces next-generation memory module standard “CAMM2” for notebook PCs - GIGAZINE

JEDEC announces next-generation memory module standard “CAMM2” for notebook PCs GIGAZINE

Specifications of high-speed memory standard 'GDDR7' for graphics cards are confirmed, communication speed is twice that of GDDR6 - GIGAZINE

Specifications of high-speed memory standard 'GDDR7' for graphics cards are confirmed, communication speed is twice that of GDDR6 GIGAZINE

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