Hardware Platforms Projects• Managed the team of the hardware platforms engineers that have been developing FPGAs and Boards to enable Arm's partners with development platforms for the latest Arm IP, subsystems/reference designs and ARM Cores• Driving several workflow improvementsSystem Guidance for Mobile• Managed the project that objective was to deliver a collection of resources (HW design documentation, performance analysis results, software guidelines, SW scripts and binaries together with the fast model) to provide a representative view of typical compute subsystems that can be designed and implemented using specific generations of Arm IPTest Chip and Board• Was responsible to deliver the platform (chip and board) to validate the first product in the ARM security enclaves product family• Worked with product marketing and system architecture teams to help define the scope of subsystems as well as managed RTL and Physical Design, multi-site engineering teams, to ensure having well defined and timely project deliverables• Worked at the program level aligning internal and external dependencies (e.g. Software and FPGA deliverables), ensuring that requirements at the program level are well understood• Actively managed the scope, deliverables and schedule of the project to meet deadlines, as well as managed risks and developed mitigation plans• Managed multi-organization teams with a mix of permanent staff, local contractors and outsourced vendors ISP Software/Hardware and Image Quality Project• Managed team that was developing Drivers, Models and Tools; Boards and Reference Platforms to support the main ISP products and partners

• Completed the project of Clean Room development for Packaging Line (FCBGA) including technology and equipment selection as well as communication with equipment suppliers, negotiations and contract management; • Managed the package development for company’s SoC: found the manufacture of substrates with desired technological rules, bridged the gap between the internal substrate design team and external manufacturing team, determined the most appropriate package type and materials (encapsulation with a metal lid, FCBGA for SiP)

Manufacturing of samples by printing, curing and assemblying (Electrically conductive adhesives, Polymers mixing, Ball grid arrays; Flip Chip bonding). Conducting electrical tests, Research and analyzing results by SEM have been carried out.

Supporting and adjusting local network, repairing equipment, updating software, consulting personnel.