Brian West Email & Phone Number

Plymouth, Michigan, United States

Holographic Weapon Sights (HWS)

Ann Arbor, Michigan

Millbury, Oh

Engineer and Quality Leader responsible for the start-up, performance, and daily operation of the new state of the art Vacuum IG pilot line implementing statistical process control (SPC), Lean Manufacturing, standardized work, preventative maintenance (PM), quality management system, audits, and managed our product certifications through the safety glazing certification counsel (SGCC). • Lead monthly performance metrics and continuous improvements plant wide• Completed plant wide capability studies on all gages per ASQ R&R requirements • Utilized six-sigma to root cause defect yield, 20-30K savings per shift• Introduced ASQ- SPC to all processes with OCAPS, reduced variability and 10% waste• Developed all WI under new lean format, added locally to SFC, re-training• Developed 8D customer response process, response rate from 2 weeks to 12 hr.• Managed and transferred quality system into new business, gage tracking and frequency• Executed all SGCC audits and accreditation on all products, hosted 2 plant audits• Improved PM systems on all process steps with frequencies and training• Introduced new laser marking system with sequential ID, improved part trace-ability• Led reporting design and implementation on systems equivalent to SAP for performance tracking• Corporate lead for QMS transfer to master control

Toledo, Ohio Area

Operations leader responsible for the hands-on fabrication, process performance, and on time delivery of microelectromechanical systems (MEMS). Led a team of 20 personal including operators, process technicians, and equipment/maintenance experts across the foundry to exceed customer delivery expectations. • Developed a product forecast model, 90 day and daily by customer and product flow• Modeled using process mapping DMAIC for all customer products by actual time• Lean activity reducing product builds by 20% reduced cycle time, eliminated waste• OTD achieved 95% with forecast buffering and daily monitoring• Outsourcing driven to 60% reduced turn around, schedule targets, value stream mapping.• Equipment uptime increase by 35%, root caused intermittent issues using DMAIC.• Developed Manufacturing hiring process, hired 10 Operators, two shifts• Hired a dedicated staffing firm, increased manufacturing personal by 60% • Added 30% permanent hire, created trainers, POC’s and training metrics• Report out daily to staff and operations on all manufacturing metrics

Perrysburg, Oh

Role served as an Integration engineer working with cross functional teams in development and manufacturing on solar module electrical performance involving design of experiment response and interactions, global manufacturing performance, and root cause investigations using six sigma methodologies.• Technical lead role for new technology performance and reliability• Reduced scrap yield loss by 45% in new process using DMAIC process, • Improved throughput by 15% by reducing tool faults by 80%, SPC, brainstorming • Executed all docs for Change management product Manufacturing Qualification including tool fingerprints, specs, FMEA’s, and OCAPS• DOE analysis and process sensitivity for new technology using JMP SAS • Change management (CMS) release of all changes, managed through MS Project• Module Performance Control Plan and IV FMEA for New Technology• Achieved root cause of 0.3% efficiency excursion, new metrology, control plan• Achieved root cause of thin film etch excursion, 0.08% efficiency impact, DMAIC• Achieved 30% reduction in P/T ratio on new gage, MSA improvement

Newark, De

Engineering manager responsible for leading global benchmark customer response process and all metrics leading to root cause of all quality related issues, new product engagements, and semiconductor consumable products. • Managed North America, Europe, and Korean regional semiconductor customers, • Created metrics to drive accountability, achieved rapid response, 55% improved, SPC • Product launch; Intel 45nm, 57% yield improvement; six sigma, MS Project, CMS• SAP utilized to determine batches and parts for supply chain related responses• Daily 8D report with root cause methodology using DMAIC, Six Sigma, Triz, FMEA• Led cross functional teams consisting of Sales, Field, Marketing, R&D, Manufacturing• Individual contribution as lead for South East Asian and Korean regional customers• Led resolution to all performance, quality, and supply chain related issues; six-sigma• Special Assignment: Product Engineer 6’08-10’08, Six Sigma Project, Urethane Casting

Newark, De

The role of lead engineer was spread over three facilities and a new solar plant start up. Responsibilities included hands on manufacturing engineering improvements, controls, and performance of all chemical process steps. Simultaneously led new break through Silicon film development pilot launch and purchase of all necessary process equipment needed for high volume manufacturing. • Lead support in all Silicon Film and single crystal Silicon processes and facilities • Lean Manufacturing project lead; improved productivity by 55%, $75K• Green Belt Six Sigma certification, $500K in annual savings• Six Sigma Black Belt, March 2005• Developed process and managed transfer from concept to HVM, $10M savings• Improved process yields by 98%, capability improvement 22%, $380K/yr savings• Design team lead; New Silicon Film continuous process equipment, DFSS• Development wet chemical in-line process monitoring controls and systems, SPC • Completed install & qualification of processes for new facility start-up, MS Project

Tualatin, Or

My role as applications engineer focused on process equipment knowledge, customer demonstration and experimental support on electrochemical deposition semiconductor equipment previously sold to tier one customers such as Intel and IBM. Critical knowledge of tool setup, project management, and data analysis were critical. Several in house experiments and special projects as well as new customer demonstrations were also additional roles I shared while employed.• Supported global customer tool demonstrations, training, and applications support• Lead support in customer purchase of $22.4M dollars of ECD equipment, MS project• Applied FMEA & QFD to root cause Cu backside contamination causing IC failures• Supported customer applications in chemical changes and new design modifications, • Customer engagements weekly, on metrics, root cause, and general customer support• Reduced raw material usage by $25K/month

Vancouver, Wa

This hands-on engineering role was involving a new semiconductor silicon wafer plant start up with no previous experience. In 3 months of my employment I had qualified all metrology and acid etching process equipment for manufacturing exceeding the plant startup deadline and being the first engineer to have processes setup and ready to manufacture within the plant. • Plant Start up; install, qualification, and production of new 8” wafer facility • Developed Alkaline Etch process condition for Intel 98 product, SPC, RCA, DMAIC• Stabilized process from start-up mode Increasing yields from 86.2% to 99.7% • Patent Awarded: 6,503,363 "System for Reducing Wafer Contamination".• Increased Output capacity by 38%, fishbone, FMEA, Brainstorming, MS Project• Reduced waste by $70K/month – recycle & chemical lifetime, CMS changes • Lead company water conservation program; CMS approved changes, $1.2M savings

Master Of Science (M.S.), Organizational Leadership

Bachelor Of Science (B.S.), Chemical Engineering

Activities and Societies: AIChEMinor - Mathematics