Brian West Email & Phone Number

Plymouth, Michigan, United States

Holographic Weapon Sights (HWS)

Ann Arbor, Michigan

Millbury, OH

• Engineer and Quality Leader responsible for the start-up, performance, and daily operation of the new state of the art Vacuum IG pilot line implementing statistical process control (SPC), Lean Manufacturing.
• Lead monthly performance metrics and continuous improvements plant wide
• Completed plant wide capability studies on all gages per ASQ R&R requirements
• Utilized six-sigma to root cause defect yield, 20-30K savings per shift
• Introduced ASQ- SPC to all processes with OCAPS, reduced variability and 10% waste
• Developed all WI under new lean format, added locally to SFC, re-training

Toledo, Ohio Area

• Operations leader responsible for the hands-on fabrication, process performance, and on time delivery of microelectromechanical systems (MEMS). Led a team of 20 personal including operators, process technicians, and.
• Developed a product forecast model, 90 day and daily by customer and product flow
• Modeled using process mapping DMAIC for all customer products by actual time
• Lean activity reducing product builds by 20% reduced cycle time, eliminated waste
• OTD achieved 95% with forecast buffering and daily monitoring
• Outsourcing driven to 60% reduced turn around, schedule targets, value stream mapping.

Perrysburg, OH

• Role served as an Integration engineer working with cross functional teams in development and manufacturing on solar module electrical performance involving design of experiment response and interactions, global.
• Technical lead role for new technology performance and reliability
• Reduced scrap yield loss by 45% in new process using DMAIC process,
• Improved throughput by 15% by reducing tool faults by 80%, SPC, brainstorming
• Executed all docs for Change management product Manufacturing Qualification including tool fingerprints, specs, FMEA’s, and OCAPS
• DOE analysis and process sensitivity for new technology using JMP SAS

Newark, DE

• Engineering manager responsible for leading global benchmark customer response process and all metrics leading to root cause of all quality related issues, new product engagements, and semiconductor consumable products.
• Managed North America, Europe, and Korean regional semiconductor customers,
• Created metrics to drive accountability, achieved rapid response, 55% improved, SPC
• Product launch; Intel 45nm, 57% yield improvement; six sigma, MS Project, CMS
• SAP utilized to determine batches and parts for supply chain related responses
• Daily 8D report with root cause methodology using DMAIC, Six Sigma, Triz, FMEA

Newark, DE

• The role of lead engineer was spread over three facilities and a new solar plant start up. Responsibilities included hands on manufacturing engineering improvements, controls, and performance of all chemical process.
• Lead support in all Silicon Film and single crystal Silicon processes and facilities
• Lean Manufacturing project lead; improved productivity by 55%, $75K
• Green Belt Six Sigma certification, $500K in annual savings
• Six Sigma Black Belt, March 2005
• Developed process and managed transfer from concept to HVM, $10M savings

Tualatin, OR

• My role as applications engineer focused on process equipment knowledge, customer demonstration and experimental support on electrochemical deposition semiconductor equipment previously sold to tier one customers such.
• Supported global customer tool demonstrations, training, and applications support
• Lead support in customer purchase of $22.4M dollars of ECD equipment, MS project
• Applied FMEA & QFD to root cause Cu backside contamination causing IC failures
• Supported customer applications in chemical changes and new design modifications,
• Customer engagements weekly, on metrics, root cause, and general customer support

Vancouver, WA

• This hands-on engineering role was involving a new semiconductor silicon wafer plant start up with no previous experience. In 3 months of my employment I had qualified all metrology and acid etching process equipment.
• Plant Start up; install, qualification, and production of new 8” wafer facility
• Developed Alkaline Etch process condition for Intel 98 product, SPC, RCA, DMAIC
• Stabilized process from start-up mode Increasing yields from 86.2% to 99.7%
• Patent Awarded: 6,503,363 "System for Reducing Wafer Contamination".
• Increased Output capacity by 38%, fishbone, FMEA, Brainstorming, MS Project

Master Of Science (M.S.), Organizational Leadership

Bachelor Of Science (B.S.), Chemical Engineering

Activities and Societies: AIChEMinor - Mathematics