Process Engineer, Photo-Etch Group April 2014-present• Manage and sustain all factory metrology, including ellipsometry, spectrometry, scatterometry, AFM, FTIR, four point probe, WDXRF, and SEM tools. • Developed numerous optical trench measurement techniques for new products.• Created novel measurements on product wafers for in-line metrology, leading to over $200,000 annual savings on test wafers and yield improvements.• Sustained silicon, oxide, and metal plasma etch processes and wet aluminum etch processes.Process Engineer, Metals Group Aug 2011-April 2014• Responsible for development and sustaining of all 8” wafer front metal processes, including Ti, TiN, TiW, Ni, and Al PVD and tungsten CVD. Knowledgeable of AMAT Endura and Centura platforms.• Improved and sustained 6” wafer barrier processes that encompass TiW, Ti and TiN PVD, tungsten CVD, and tungsten etch back.• Sustained all rapid thermal anneal and silicidation processes.• Managed all front side metrology equipment since February 2013. • Implemented improvements for cost reduction, throughput, and OEE.Process Engineer, Photolithography Feb 2011-Aug 2011• Optimized polyimide processing to improve adhesion on passivation and aluminum surfaces.• Implemented yield improvements through defect management.• Responsible for reticle management which enabled a $75k cost savings on reticle pods. Diffusion Process Engineer Co-op May 2010-Feb 2011• Increased throughput 44% for a Ti-TiN barrier process on a single-thread Oerlikon PVD tool. • Investigated polysilicon furnace capacity improvements.• Assisted metrology by creating recipes for all areas of the fab.

• Fabricated MOSFETs, MOS capacitors, pn junction diodes, and Schottky diodes• Optimized photolithography to enhance overlay, wet and dry oxidation to improve growth uniformity, wet and dry etching, diffusion doping, and metal evaporation processes to improve quality of yield• Performed physical and electrical characterization on PV and microelectronic devices to evaluate performance

• Repaired electrical circuits and inventoried 1000+ electronic components to organize the physics department stockroom• Assembled and took apart both physics and electronics labs, and graded 100+ student assignments per week

• Incorporated rare-earth elements into InxCoSb3 thermoelectric materials to improve their efficiency by reducing the resistivity and thermal conductivity• Characterized products using powder XRD to confirm crystal structure and vacuum resistivity measurements to evaluate the electrical conductivity

• Collaborated with students, facility personel, and Bonneville Environmental Foundation to offset 100% of the energy usage of Southern Oregon University with renewable energy