Mitul Modi Email & Phone Number

Chandler, AZ

Lead definition of the Client Segment (>$8B quarterly revenue) product package architectures by integrating customer performance, system, and cost requirements, advanced packaging technologies, electrical specifications, system thermals, manufacturing, and reliability. Noteable technology achievements include architecting the industry’s first Foveros 3D.

Lead the Package Architecture and Assembly Process Co-design for new or disruptive microelectronic assembly programs. Responsible for initiating new equipment selection where process gaps exist and leading process development to establish a manufacturing baseline. A key achievement was the definition and development of Intel's first ultra-thin and low-cost.

Serve as the Microelectronic Component FLI (First Level Interconnect) Architect for proof-of-concept and disruptive technology platforms that achieve Moore's law scaling, aggressive cost reduction, and significant leaps in component performance. Responsible for driving cross-organizational, multi-disciplinary teams to execute modeling, small-scale assembly.

Managed a 5 person team responsible for forecasting and finding solution to mechanics related gaps in Silicon Sort and Final Component Test. Some key highlights include: 1) establishing the Intel first ever Sort Probe fundamental failure mechanism characterization and mechanics/materials based design rules and 2) delivery of a Back End Test Finite Element.

• Senior engineer responsible for delivering technical contributions in the area of materials development and structural mechanics for Intel CPU/Chipset Research and Development programs.
• Managed Assembly and Test Technology Division’s research deliverables. Defined the structural mechanics technology roadmap for Intel’s products 4-5 years from HVM. Drove solution to the roadmap gaps and made.
• Delivered the Mechanical Technology Performance Specification to achieve technical certification for over 8 Intel product platforms. Meeting these deliverables was achieved through a self-managed program using modeling.
• Expansive portfolio of technical contributions, many of which were “industry firsts”, in the application of finite-element and self-developed analytical approaches. Established organization-wide recognized content.

Survivability Engineer, 1997-1998Test Lead for the Terrain Sensor Laboratory focused on development of terrain mapping for the Grizzly Countermine Vehicle. Responsibilities include test/experiment design, instrumentation installation, data acquisition, post-test data analysis, test software design/coding, and prototype design/development. Test and.

Ph.D., Engineering - Solid Mechanics

Activities and Societies: President Microelectronics Packaging Research Center Student CouncilDesign, fabrication, and reliability.

M.S., Industrial Engineering

B.S., Mechanical Engineering