Lead Mechanical Engineer for the compute blade for Aurora Exascale Supercomputer installed at Argonne National Laboratory which is a fully liquid cooled system. It is currently the top for AI with 10.6 exaflops of AI performance. Developed all aspects of mechanical design for the GPU solution including overall mechanical architecture, layout, board ECAD, liquid thermal solution hardware, detailed parts design, prototypes, FAI, and production.

Sole Mechanical Engineer for Programmable Platform Engineering responsible for Development Systems and Branded Boards mechanical architecture and design. Worked with 20+ members, multi-shore design teams on systems designs, prototypes, and production runs. Developed all aspects of mechanical design for FPGA acceleration cards including overall mechanical architecture, layout, detailed parts design, prototypes, and pre-production to contract manufacturer. Lead the FPGA mechanical socket and thermal solution design to support multiple FPGA package sizes with both air and liquid cooling support.

Played an instrumental role in leading the calibration equipment design, ODM installation, and production effort for developer units. Worked with 20+ member, multi-shore ODM team on systems design and production runs. Established and developed virtual reality and augmented reality systems with ODM and China team. Built VR developer units and 10 AR customer units for technology development and trade shows. Introduced and implemented Lean manufacturing principles and successfully designed and integrated depth camera into existing customers tablet for potential design win. Innovatively designed and built depth camera calibration equipment and fixtures utilizing robot control. Designed and prototyped depth camera peripheral for VR headset for customer review. Facilitated communications and designed and integrated multiple depth cameras into existing production system. Developed 6” phablet with integrated depth camera and IMU for developers with 1K build.

Drove and orchestrated mechanical design efforts for 2 perceptual computing concepts that showcased the world’s first integrated depth camera and integrated eye tracking camera in an Ultrabook and adaptive All-In-One (AIO) form factor. Received perceptual computing award for CES readiness. Developed and built the world’s thinnest notebook reference design with leather wrap Eink display accessory. Received Intel Achievement Award (IAA) for the project. Served as mechanical lead, drove both strategic and tactical project direction and design for the concept and production version of a thin AIO, ultra-thin notebook, and road warrior adjustable laptop. Designed an integrated digital office notebook and slim desktop designs using the same motherboard and layout design – received IAA with team for accomplishments. Built, designed, and prototyped 3 interchangeable cooling solution for 15” notebook using pumped liquid water, pumped liquid metal, and standard heat pipe technology. Oversaw and managed all aspects of improving mechanical design solutions for an 11.1” LCD convertible.

Sole mechanical/thermal/acoustic engineer for 2 project teams consisting of 10 engineers and subject matter experts that effectively designed leading-edge concept desktop systems with thermal and acoustic headroom. Developed the thermal/mechanical design for the OEM 9 liter system which greatly improved on the existing system acoustics and lowered the systems noise level dramatically; awarded Division Recognition Award for project. Built the smallest, quietest Pentium 4 desktop PC with headroom for the entire processor family in a 5.8 liter system design with industry leading acoustics of 23 dBA. Co-owned and co-presented “Quiet Design of a Small PC System” at Intel Developer Forum 2002 US/Asia tour. Created and delivered custom desktop system with oversees ODM within a 2-month period. Designed and prototyped thermal/mechanical fan less systems for Intel Developer Forum.

Served as engineering subject matter expert in thermal/mechanical solutions for Intel’s first microATX and Pentium 4 validation systems. Analyzed the entire product development process for workflow issues both cross-functionally and within mission-critical units to implement solutions. Managed contract thermal analysis vendor for NLX Pentium 4 system. Leveraged deep understanding of how technologies interact and impact each other and identified how system-level synergies drive greater customer value. As Sustaining Design Engineer on Olympus, Nina, and Galileo based systems, successfully managed increased multiple customer’s production of locally manufactured desktop systems. Mechanical engineer on ATX, microATX, FlexATX, and device bay specifications.