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@intel.com
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2 phones found area 408
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Ron Egger is listed as Staff Mechanical Design Engineer, Intel Data Center Group at Intel Corporation at Intel Corporation, a company with 133841 employees, based in Banks, Oregon, United States. AeroLeads shows a work email signal at intel.com, phone signal with area code 408, and a matched LinkedIn profile for Ron Egger.
Ron Egger previously worked as Staff Mechanical Design Engineer, Intel Datacenter and AI Group at Intel Corporation and Staff Mechanical Design Engineer, Intel Programmable Solutions Group at Intel Corporation. Ron Egger holds Bachelor'S Degree, Mechanical Engineering from Oregon State University.
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AeroLeads found 1 current-domain work email signal for Ron Egger. Compare company email patterns before reaching out.
High-performance, results-driven, design engineer with demonstrated experience in managing high-profile projects within the consumer electronics, high-tech, and lean manufacturing industries. Specializing in concept, product and system design. Proficient at working with OEMs and ODMs to develop projects with compressed schedules. Well versed in designing and building desktop, mobile, perceptual computing, FPGA PCI cards, and supercomputer systems within high-volume manufacturing environments.Exceptional technical acumen tuned for effectively leading global, cross-functional teams of architects, software and hardware experts, and key stakeholders. Track record of developing and integrating new technology into leading-edge system designs and platforms. Adept at breaking down complex problems into simple solutions. Achieved award-winning concept system and production designs of 14 desktops, 17 clients, 15 perceptual, 9 programmable solution projects, and Aurora Exascale Supercomputer at Intel.
Listed skills include Design For Manufacturing, Electronics Packaging, Pro Engineer, Product Design, and 24 others.
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A career timeline built from the work history available for this profile.
Portland, Oregon Area
Lead Mechanical Engineer for the compute blade for Aurora Exascale Supercomputer installed at Argonne National Laboratory which is a fully liquid cooled system. It is currently the top for AI with 10.6 exaflops of AI performance. Developed all aspects of mechanical design for the GPU solution including overall mechanical architecture, layout, board ECAD.
Portland, Oregon Area
Sole Mechanical Engineer for Programmable Platform Engineering responsible for Development Systems and Branded Boards mechanical architecture and design. Worked with 20+ members, multi-shore design teams on systems designs, prototypes, and production runs. Developed all aspects of mechanical design for FPGA acceleration cards including overall mechanical.
Portland, Oregon Area
Played an instrumental role in leading the calibration equipment design, ODM installation, and production effort for developer units. Worked with 20+ member, multi-shore ODM team on systems design and production runs. Established and developed virtual reality and augmented reality systems with ODM and China team. Built VR developer units and 10 AR customer.
Portland, Oregon Area
Drove and orchestrated mechanical design efforts for 2 perceptual computing concepts that showcased the world’s first integrated depth camera and integrated eye tracking camera in an Ultrabook and adaptive All-In-One (AIO) form factor. Received perceptual computing award for CES readiness. Developed and built the world’s thinnest notebook reference design.
Portland, Oregon Area
Sole mechanical/thermal/acoustic engineer for 2 project teams consisting of 10 engineers and subject matter experts that effectively designed leading-edge concept desktop systems with thermal and acoustic headroom. Developed the thermal/mechanical design for the OEM 9 liter system which greatly improved on the existing system acoustics and lowered the.
Portland, Oregon Area
Served as engineering subject matter expert in thermal/mechanical solutions for Intel’s first microATX and Pentium 4 validation systems. Analyzed the entire product development process for workflow issues both cross-functionally and within mission-critical units to implement solutions. Managed contract thermal analysis vendor for NLX Pentium 4 system..
Other employees you can reach at intel.com. View company contacts for 133841 employees →
Sharath Viswanathan
Colleague at Intel CorporationBengaluru, Karnataka, India, India
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DV
Dayne Vialpando
Colleague at Intel CorporationBeaverton, Oregon, United States, United States
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EO
Emmanuel Okrah Jr.
Colleague at Intel CorporationGreater Boston, United States
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TM
Tal Magnagi Barkai
Colleague at Intel CorporationIsrael, Israel
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EG
Enrique García
Colleague at Intel CorporationZapopan, Jalisco, Mexico, Mexico
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PM
Pavani Medapuram
Colleague at Intel CorporationHillsboro, Oregon, United States, United States
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JH
Jenny Hernandez
Colleague at Intel CorporationFremont, California, United States, United States
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TS
Taphne Sisto
Colleague at Intel CorporationOrangevale, California, United States, United States
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AA
Alaa Abo Alheja
Colleague at Intel CorporationHaifa, Haifa District, Israel, Israel
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LW
Li-Sheng Wang
Colleague at Intel CorporationBeaverton, Oregon, United States, United States
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Quick answers generated from the profile data available on this page.
Ron Egger works for Intel Corporation.
Ron Egger is listed as Staff Mechanical Design Engineer, Intel Data Center Group at Intel Corporation at Intel Corporation.
AeroLeads has found 1 work email signal at @intel.com for Ron Egger at Intel Corporation.
AeroLeads has found 2 phone signal(s) with area code 408 for Ron Egger at Intel Corporation.
Ron Egger is based in Banks, Oregon, United States while working with Intel Corporation.
Ron Egger has worked for Intel Corporation and Intel.
Ron Egger's colleagues at Intel Corporation include Sharath Viswanathan, Dayne Vialpando, Emmanuel Okrah Jr., Tal Magnagi Barkai, and Enrique García.
You can use AeroLeads to view verified contact signals for Ron Egger at Intel Corporation, including work email, phone, and LinkedIn data when available.
Ron Egger holds Bachelor'S Degree, Mechanical Engineering from Oregon State University.
Ron Egger is listed with skills including Design For Manufacturing, Electronics Packaging, Pro Engineer, Product Design, Solidworks, Tolerance Analysis, Semiconductors, and Design Of Experiments.
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