Robert Gibson Email & Phone Number

Burlington, Vermont Area

Custom Compute and Storage (CCS) Business Unit at Marvell designs and develops advanced semiconductor chips for external customers in market segments ranging from artificial intelligence and machine learning to networking and 5G infrastructure. Leading a team of engineers who provide a broad range back-end physical design (PD) and design-for-test (DFT) services; ASIC Engineering Design Automation (EDA) flows for place and route, DFT, and physical verification (PV); and subject matter expertise in IP integration and DFT. Delivering solutions in the world's most advanced semiconductor nodes.

Burlington, Vermont Area

Led an engineering team that delivered ASIC Engineering Design Automation (EDA) flows and customer chip designs in 14nm and 7nm semiconductor nodes with a special focus on Design for Test (DFT) until the acquisition of this business unit (aka Avera Semiconductor) by Marvell Semiconductor, Inc.

Burlington, Vermont Area

Established operational procedures and metrics that ensured compliance with all contractual obligations with the State of Vermont and commercial clients.

Burlington, Vermont Area

Promoted VITL’s products and services related to the Vermont Health Information Exchange (VHIE) and Health IT Consulting Services to healthcare organizations in Vermont, managed public relations and media activities, education and outreach to the broader stakeholder community, and the developed new business opportunities designed to support VITL’s financial sustainability.Organized and hosted the annual VITL Summit, Vermont’s largest health IT conference which brought together nationally recognized speakers and presenters to promote health IT in the state and the region.

Burlington, Vermont Area

Increased adoption of networking equipment and software technologies in Cloud, big data appliance solutions, and reference architectures by leading solution portfolio team for IBM system networking.

Burlington, Vermont Area

Managed a team of Business Development professionals which generated technology licensing income from IBM systems and storage Intellectual Property. In 2011, led group-wide task force to evaluate and establish a pipeline of licensing opportunities.

Burlington, Vermont Area

Developed new business opportunities for Power Architecture based High Performance Computing Solutions and led the offering definition of the IBM Power 755 High Performance Computing Server.

Burlington, Vermont Area

Managed the world-wide industry solutions team for IBM BladeServer QS21 and QS22, IBM Software Development Kit for Multicore Acceleration, and IBM custom Cell/B.E. Solutions. This team of high-performance industry offering experts positioned IBM Cell/B.E. solutions in key industries: Aerospace and Defense, EDA, Financial Services, Oil and Gas Exploration, and Public Sector. Personnel manager for the IBM Future Technology Solutions Development Center, a technology development center co-funded by IBM and the State of Indiana.

Burlington, Vermont Area

Managed IBM’s world-wide PowerPC Embedded Processor and Digital Video Product business (> $400M Annual Revenue). Consistently meet quarterly and annual objectives for Design-Wins, Production-Wins, Revenue, Expenses and other key business metrics. Provided leadership to multiple strategy and growth initiatives to define future product roadmaps. Team was composed of certified project managers and product offering managers.

Burlington, Vermont Area

Led a team of Business Development Managers and Solution Architects who created top-line revenue growth at key networking accounts. Closed 2003 Design-In Plan at 102% of target. Secured significant 64bit processor design-in and associated services at key telecom equipment provider and increased IBM market share (ASIC and microprocessor) at top accounts.

Burlington, Vermont Area

Responsible for driving revenue growth and increased semiconductor market share at premier EMEA accounts and select emerging accounts. Secured key design-ins at top networking accounts. Initiated and managed several segment-based initiatives to increase market penetration.

Burlington, Vermont Area

Managed team responsible for IBM business relationships with Strategic Networking ASIC Customers. Responsible for current business (>$100M Annual) at existing accounts including RFQ responses, contract negotiations, project management, and customer satisfaction. Developed executive relationships required to increase business at key customers. Managed critical customer relationships through introduction of new 130nm ASIC products. Increased market share in 3G Mobile Infrastructure at a leading European Telecom provider and secured initial design-wins in Asia/Pacific region.

Burlington, Vermont Area

Built a worldwide technical support team for IBM’s emergent network processor and switch fabric product line. Staffed and managed System Applications Engineering, which provided system level, pre-sale technical support to customers. This team secured major design wins at key networking companies. Simultaneously staffed Product Applications Team which provide post-sale technical support.

Burlington, Vermont Area

Appointed to a New Business Development Task Force by the Division General Manager to focus on top revenue producing design wins. Secured over $100M in new design wins for IBM Microelectronics.

Burlington, Vermont Area

Lead Application Engineer for what was, at the time, IBM’s largest single ASIC customer. Responsible for over $150M in new 0.25 and 0.18 micron design wins. Focused on key relationships with project and executive management to build IBM’s reputation as the leading ASIC supplier to this crucial networking company. First Application Engineer to provide ASIC customer training at customer sites. Only Application Engineer certified to teach all sections of customer education class. Trained many of IBM’s Field Application and Field Design Center Engineers.Lead Engineer for an international product development effort. The ALDC1-20S-LP Data Compression product was developed under contract with a major Japanese electronics firm. Responsibilities included consulting with the customer to determine product requirements, specifying the product architecture, leading the design team, and managing all technical aspects of the program from business case development through manufacturing feasibility. The ALDC1-20S-LP began shipping in production volume in June 1996.

Endicott, Ny

Logic design engineer for mainframe processor development projects. Notable projects: Implementation of ANSI Fiber Channel Standard (FCS) communication protocol layers FC-1 and FC-2 in an IBM CMOS technology integrated circuit; design of an IBM Microchannel adapter card which provided an interface between an IBM 370/XA system and a Microchannel system; and, design of an CMOS embedded controller for use in the fiber optic channel of an IBM 370/XA computer system.

Lexington, Kentucky Area

Designed, implemented, and supported custom test equipment for electro-mechanical subassemblies of typewriters and printers.

Lexington, Kentucky Area

Three co-op terms in the following areas: Test Engineering, Quality Engineering, and Facilities Engineering.

Louisville, Kentucky Area

Civilian DOD employee.Two cooperative engineering terms in Gun-Fire Control Engineering.

Ms, Computer Engineering

Emphasis in parallel computer architectures

Bs, Electrical Engineering

Activities and Societies: Honors Society, Eta Kappa Nu, Tau Beta Pi, Marching Band