PREVAIL Project

The PREVAIL project will establish and start operating the core of a networked, multi-hub platform providing prototype chip fabrication capability in advanced technology to EU stakeholders for Artificial Intelligence applications. PREVAIL is supported by the Digital European Programme. Who we are Our consortium includes four major European RTOs: CEA-Leti, imec, Fraunhofer, and VTT. We will build on our advanced 300mm fabrication, design, and test facilities in a coordinated and complementary fashion to create a new multi-hub Test and Experimentation Facility for edge AI Hardware. What do we offer? PREVAIL will enable a trusted infrastructure in Europe where companies and research institutions will be able to fabricate early prototype samples based on innovative technologies and test them in real edge AI applications. Our offer will include the most promising technologies developed by the consortium partners to address the specifications required by edge AI chips: - Advanced non-volatile embedded memories (MRAM, OxRAM, FeRAM) - 3D heterogeneous integration and assembling (die to die, die to wafer, die to substrate, wafer to wafer) - Integrated photonics and RF components