Stephen Barbagallo Email & Phone Number

Kirkland, Wa, Us

Hawthorne, California, Us

Hawthorne, California, Us

Gotta get the internet into space somehow

Hawthorne, California, Us

Hawthorne, California, Us

Hawthorne, California, Us

-Expanded scope of responsibility to include Starlink Ku payload, Ka payload, and select critical avionics PCBAs.-Supported containment activities associated with manufacturing and piece part non-conformances by correlating hardware test results with material trace databases -Utilized in-depth knowledge of manufacturing process flows to identify root causes of non-conformances found on Starlink hardware, often completely remotely from the manufacturing site.-Used empirical production data to strategically implement in-process inspections and sampling rates as applicable throughout the Starlink supply chain to maintain product conformance, while reducing hardware lead times as much as possible -Worked in a team of 4 to define and implement a standardized first article inspection procedure for high volume microelectronics assemblies.

Hawthorne, California, Us

-Responsible for supply chain quality & conformance for the Starlink Ku payload and cable harnesses.-Wrote detailed specifications to effectively qualify SpaceX microelectronics assemblies to accepted industry standards.-Worked in a core team of 3 engineers to perform bring-up efforts for first generation Starlink Payload through tactical on the ground work at contract manufacturers. Activities included: -Performing qualifications of PCBA manufacturing processes such as solder paste print, solder paste inspection, component pick and place, reflow, X-ray inspection, ICT, and custom functional tests. -Providing rapid engineering disposition for non-conforming hardware and manufacturing processes. -Supporting efforts to improve packaging of payload hardware to reduce handling damage and eliminate packaging bottlenecks.

Hanover, Md, Us

As a manufacturing engineer at KeyW, I worked to implement experiments focused on optimizing our manufacturing processes of packaged electronic materials. These experiments provided data which was in turn used to continuously measure, quantify, and standardize our group's internal R&D. I interacted with a wide variety of material types, including traditional PCB materials, epoxies, prepreg laminates, and solder pastes.My work also focused on identifying root cause of failure in material processes used for final assemblies. To achieve this, I performed statistical analysis on failed samples, to identify which factors in our manufacturing processes most strongly impact material failure and performance. This analysis was performed on electronic packaging processes such as wirebonding, multi layer PCB lamination, and epoxy dispensing & application. Finally, I assisted in the design of communications products with consideration to chemical, mechanical, electrical, magnetic and thermal constraints while still considering manufacturability.

I work as an indoor climbing instructor at Earthtreks climbing center, where I coach students across a large variety of skills and experience levels. I teach instructional courses in a variety of technical safety skills associated with climbing and mountaineering. Additionally I lead customized clinics focused on movement skills and biomechanics associated with climbing, with specialized consideration to individual climbers' body types and existing skill sets. By utilizing robust technical, and soft communication skills, I am able to effectively help students of all experience levels reach their climbing goals

Gaithersburg, Md, Us

While at NIST I worked in the Physical Measurements Lab on an Extreme High Vacuum (XHV ) system, maintaining pressures on the order of 10E-11 Torr. The goal of our group was to develop and characterize a single atom transistor using Scanning Tunneling Microscopy (STM) as a lithography. My research explored what processing conditions most greatly affected diffusion in an aluminum/silicon system. Additionally I used wet etching techniques, and scanning electron microscopy (SEM) to explore and qualify whether aluminum diffusion (spiking) in a silicon system could be used as a novel electronic contacting technique for buried quantum and single atom devices. Final SEM image analysis was performed using a custom MATLAB program I designed for the detection of "spikes". This image analysis was used to predict what process parameters would be necessary for successful aluminum contact of buried quantum devices.

I worked with the Rubloff group, with a focus on understanding Atomic Layer Deposition (ALD) and how it may be applied to a new generation of energy storage and nano-manufacturing. While a member of the group I operated and maintained vacuum equipment and systems, and helped in the automation of our hybrid ALD/XPS/Evaporator system.In addition to maintaining associated equipment, I assisted with research focused on the selective deposition of ALD processes on graphene. During these efforts, I utilized Raman and SEM to characterize my samples and manage my data.

College Park, Md, Us

I assisted in teaching a section of ENES100, an introductory level engineering course required of all students in the Clark School. Throughout the course of the semester I taught students a variety of prototyping skills including CAD, 3-D Printing, Soldering, Breadboarding, and basic Arduino Coding.

Newark, Delaware, Us

While at W.L. Gore I worked in the Electronic Products Division as an intern designing a new experimentation method for the effective testing of thick film PTFE dielectrics. My new test methodology aimed to test both the Breakdown Strength, and Voltage endurance of films, at high voltage stress levels. to qualify my test, I used JMP to prove that my test generated statistically comparable results to the existing test methodologies, so as to reduce my group's uncertainty in this new characterization method. As an intern, my time was limited to develop and verify this test methodology, so I used a rapid iterative process to 3-D print and try new dielectric test cell designs. By testing 3-4 test cell designs in parallel I was able to quickly identify which test conditions would be suitable for an effective experiment at the necessary stress levels.

College Park, Md, Us

Philadelphia, Pa, Us

Master Of Science (M.S.), Materials Engineering

Bachelor Of Science (B.S.), Materials Engineering